Responsibilities:
* Improvement and development of manufacturing plans for photonic and electronic circuits and their system integration.
* Supporting technology strategy and road mapping for future leading-edge packages and packaging solutions.
* Providing program, project, and team management on high-tech R&D initiatives, New Product Introduction, Business Process Modelling, component development, and complete product solutions.
* Improving product manufacturability, performance, quality, testability and reliability.
* Leadership, responsibility, and open innovation role.
Minimum Requirements:
* 3+ years’ experience as Senior Engineering Manager, Operations Manager or similar.
* Rich background in the development of semiconductor & electronics packaging, advanced wafer fabrication, process integration, and other electronic and electro-optical device technologies.
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